BiPass I/O and Backplane Cable Assemblies
In data centers and telecommunication infrastructure, 56 and 112 Gbps PAM-4 signaling is the latest development in serial data signal formats. Implementation of high data rate protocols such as PAM-4 require a clean channel. Compared to PCB materials, BiPass I/O Cable Assemblies dramatically reduce insertion loss between the ASIC and the front panel I/O, creating greater channel margins.
QSFP-DD Interconnect System and Cable Assemblies
Telecommunication and data center customers have increasing bandwidth requirements and, therefore, require high-density interconnects. QSFP-DD Interconnect System enables faceplate density equal to the current 2x1 QSFP form factor, but with 8-lane ports.
Impulse Orthogonal Direct Backplane Connector System
As data rates are expected to continue increasing, data centers look for scalability in equipment to minimize future infrastructure investments. Impulse Orthogonal Direct Backplane Connectors are forward compatible to meet future data rate requirements without the need to replace infrastructure.