The Latest Talk
Our VersaBeam™ expanded beam ferrule technology and single-mode silicon photonic active optical products will support the new MXC* fiber optic interface. These and other Molex high-speed, high-density data transmission technologies will be featured at booth 3863, OFC 2014 being held March 11-13 in San Francisco.
Find more about Molex Technologies: http://ow.ly/umtcI
A rugged integrity shielding, two-circuit, HVHC connector system for hybrid-electric and electrification
The first orthogonal style power connector offering a 60.0A solution via 30.0A in-and-out routing based on a split-blade configuration