Ready for Pack Expo? We are – and we look forward to seeing you there. October 28 – 31st in Chicago (Molex Booth S2957)

This is our third year exhibiting and we look forward to learning about new industry innovations, having terrific discussions with customers and sharing our exciting new automation products for machine builders and robot manufacturers in the packaging industry.

This year we will be highlighting several new Brad ™ connectivity, communications, control and power solutions including the Ultra-Lock M12 EX Connection System, Brad Harsh I/O, Brad Micro-Change Circular Hybrid Technology and M12 CAT 6a Connector System.  These products work well in harsh environments, offer high speed connections and are part of an integrated automation system to support the automation industry needs.  The Brad solutions are specially designed to endure and meet the toughest standards, while delivering advanced features like anti-vibration technology and convenient, secure connections that help maintain system performance, minimize downtime and simplify maintenance.

In addition to showcasing many Brad ™ products, we will also have new interactive kiosks in our booth to provide immediate feedback for anyone interested in learning more about Molex solutions.

We look forward to seeing you there.

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About the author

Larry Wegner is the Global Director of Marketing Communications for Molex. With over 30 years of experience, Larry continues to keep a pulse on the trends and issues driving the ever-changing electronics industry.

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